1Solve for
Current: maximum current a given trace width can carry. Trace width: minimum width needed for a given current. Temp rise: resulting ΔT for a given width and current.
2Trace & layer
0.0348 mm (1.37 mil) thick
3Operating conditions
39.4 mil
Results
✓ Final trace temperature within board/component limit
Current capacity
3.23A
Final trace temperature
45°C
limit 105°C
Cross-sectional area
53.9mil²
0.0348 mm²
Trace resistance
27.14mΩ
Voltage drop / power
87.7mV
0.283 W dissipated
Reference & assumptions

New to IPC-2221? Read the guide: PCB Trace Width & Current Capacity: What IPC-2221 Actually Says — a plain-language explainer of the standard behind this calculator.

Current capacity, required trace width, and temperature rise come from the IPC-2221 (formerly IPC-D-275) empirical curve fit I = k·ΔT^0.44·A^0.725 (k = 0.048 external / 0.024 internal) — the same equation nearly every published PCB trace-width calculator implements. It's a curve fit to IPC's original thermal test data, not a first-principles derivation: modelling how a trace actually sheds heat (in-plane spreading through copper pours and plane layers, through-thickness conduction into FR4, heat paths out through connectors and vias) is a full 3-D FEA problem with no closed form — which is exactly why IPC's newer IPC-2152 standard, which refines the underlying test data for board thickness, adjacent plane layers, and trace length, publishes only charts rather than a formula. This tool computes from the disclosed IPC-2221 equation rather than transcribing unverifiable IPC-2152 chart readings. Trace resistance, voltage drop, and power dissipation are genuinely first-principles, using the same temperature-dependent copper resistivity model as the Busbar and Cable/Wire Sizing calculators. Treat this as a screening/estimation tool — for high-reliability designs, cross-check against your fab's process capability and, where available, IPC-2152 chart data or thermal simulation.

Validated: a 10 mil, 1 oz external trace at 10°C rise returns 0.88 A from the exact IPC-2221 equation — in the same range as the ~1 A figure commonly quoted as a rule of thumb for that exact case (rule-of-thumb roundings vary slightly by source; this tool always computes from the equation directly). All three solve directions (current/width/temperature rise) round-trip back to their inputs exactly, and an internal-layer trace of the same geometry returns exactly half the external layer's current capacity, as the k = 0.024 vs 0.048 constants require.

Calculation steps
1. Cross-sectional area
A [mil²] = w [mil] × t [mil]; t from copper weight (1 oz/ft² ≈ 1.37 mil / 0.0348 mm)
w = 39.37 mil, t = 1.37 mil (1 oz/ft²)
A = 53.9 mil² (0.0348 mm²)
2. Current capacity (IPC-2221 empirical curve fit)
I = k · ΔT^0.44 · A^0.725
k = 0.048 (external), ΔT = 20°C, A = 53.9 mil²
I = 3.23 A
3. Trace resistance (temperature-dependent copper resistivity, reused from the Busbar calculator)
R = ρ(T_final) · L / A_cross
T_final = 45°C, L = 50 mm, A_cross = 0.0348 mm²
R = 27.14 mΩ
4. Voltage drop & power dissipation
V = I · R, P = I² · R
I = 3.23 A, R = 27.14 mΩ
V = 87.7 mV, P = 0.283 W
5. Final trace temperature vs board/component limit
T_final = T_ambient + ΔT
25°C + 20°C, limit = 105°C
T_final = 45°C — pass